Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
Advanced systems for side-view optical inspections of BGA, μBGA. FipChip, CSP, CGA solder bumps
Premium imaging quality for fast and flexible inspection, measurement and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and SMD components.
Optical BGA Inspection System ProX, Side-view/Top-view
Product No. BGA-002
Premium BGA Solder Joints Inspection
Superior Optical Performance
New generation side-view optical BGA inspection system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components. Variable focus capability of the optics with a flexible, electronically dimmable incident microprism and background fiberoptics lightings allows the user to image from first to up to 20 rows of BGA solder bumps.
Powerful still easy-to-use software providing tools for live image view, advance camera control, image/video/audio capture, geometrical measurements, image overlays and comparison, focus stacking, annotations and reporting among other features.
Developed for Productivity
High resolution optics coupled with high-power LED lighting system, robust optical probe and fast USB3.0 camera interface produces clear, crisp and high frame-rate real-time video of the hidden solder joints.
Advanced, Flexible and Reliable system
Variable focus capability of the optics allows the user to image from first to up to 20 rows of BGA solder bumps with its flexible, electronically dimmable fibre brush light as background illumination.
5.0Mp USB3.0 digital camera with custom-designed optics creates bright images of hidden solder joints down to 40 microns stand-off.
Robust Desgin for Ease-of-Use
Rigid stand with course/fine axial alignment, large base and precision xy-stage. A unique soft-touch mechanism design in the stand bracket protects the micro-prisms in the optical probe tip from damage when positioned on surface of the inspection PCB.
Integrated micro-prism and soft fiber-brush background light with electronic dimmer.
180º pivoting mechanism for easy alignment of the probe along 3 different sides of the BGA package.
Software includes a report and certificate generator with user-defined templates. Measurement data and comments are automatically imported with selected images.
Data table is generated automatically and linked to the measured image and printed in Report. Results can also be exported to Excel or other programs.
Flexible and Versatile Inspection System
Thanks to its interchangeable side-view and top-view optics the Inspectis optical BGA inspection system provides a flexible and versatile inspection solution for efficient use of investment budget for all post-production or R&D optical inspetion tasks.
Specifications System
Imager1/2.5” CMOS, Colour 5 million Pixels.
Pixel Size / Resolution2.2 μm x 2.2 μm / 2592(H) x 1944(V) pixels
InterfaceUSB3.0 / USB3.1 Gen 1 (backwards compatible with USB 2.0)
Digital Camera ControlAuto/Manual Exposure, Frame Stacking, Contrast, Brightness, Gamma, Sharpness, High Dynamic Range, Auto/Manual White Balance, Flip H, Flip V.
Preset/Recall Memories2 factory set and 2 user definable with quick access buttons.
Preset/Recall calibrated magnifications5 factory set and 10 user-definable calibrated magnifications with quick access buttons.
Image CaptureSnap switch on device, foot-pedal or by software
Video & Audio Capture formatJPG, PNG, AVI
MountUNC 1/4″–20
IlluminationIncident LED light + micro-prism background light LED + fiber-optics brush light (goose-neck) LED. Electronic light intensity control.
StandLarge base antistatic coated stand with coarse/fine precise axial rack&pinon movement, ±90° pivoting function and soft-touch probe protection mechanism.
XY-StagePrecision XY-board, 50x50mm travel range with micrometre drive. Antistatic protected. Freely movable on the stand base.
• Advanced systems for side-view optical inspections of BGA, μBGA. FipChip, CSP, CGA solder bumps
• Premium imaging quality for fast and flexible inspection
• measurement and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and SMD components.
• Inverted Microscope for Weld Analysis and Documentation
• High-resolution, ergonomic inverted 4K optical system
• with x26:1 motorised zoom, and precise auto-focus
• designed for performing accurate weld bead analysis, measurement, and documentation with minimum efforts.
• Inverted Microscope for Weld Analysis and Documentation
• Dedicated digital inverted microscope with Full HD image quality
• Large field of view range, ~ 84 to 3 mm (~3.3” to 0.12”), equivalent to ~2.5x to 71x optical magnification or ~ 7.2 to 205x on screen magnification.
• Developed for Ease-of-Use
• New Generation FHD Digital Microscope with 40x Motorised Zoom and Superior Optics.
• Excellent Image Quality
• New generation modular digital microscope in Full HD with upgraded image sensor
• new zoom lens producing vibrant video at 60 fps and low latency. 40:1 motorised optical zoom, swift centre-spot auto focus,
• 4K Digital Inspection System
• Easy to Setup and to Use
• Video Output Ultra HD 2160p/30 fps switchable to FHD 1080p/60 fps
• Imager 8.5 Mpixels. 3840(H)x2160(V) 16:9 format. Progressive scan CMOS image sensor
• Pixel Size (resolution) 1.62 μm x 1.62 μm
• Lens Megapixel motorised 30:1 zoom with auto-focus, iris control and pre-calibrated optics
• Illumination LED RingLight with detachable diffuser and electronic dimmer.
• Digital Capillaroscope, Extensive
• Nailfold Capillarocopy system for Professionals
• Extensive digital Capillaroscope system package with Laptop, pre-installed software, 3-pedal foot switch , microscope holder, oil dropper, and medical cart.
• Video Output 4K 2160p, 60 frames per second, 8.4Mp
• U50s 4k 60fps Digital Microscope System Package
• Vivid 4K Video at 60 fps and Low Latency
• Breakthrough Technology
• Fast and Accurate
• Superiour Optics for Inspection of Fine Details
Datasheet
PDF, 2.12 Mb
